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Numerical Analysis of the Reliability of Cu/low-k Bond Pad Interconnections Under Wire Pull Test: Application of a 3D Energy Bas
STMICROELECTRONICS SA Crolles (Crolles, Auvergne-Rhône-Alpes)
Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement
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Evaluation for Intra-Word Faults in Word-Oriented RAMs
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